| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for air flow control inside a chamber and permit cluster tool formation by completely eliminating reattachment of mist and contamination to a wafer surface. SOLUTION: A ultrasonic vibration device 6 is arranged in an upper side of a wafer pad 3. The ultrasonic vibration device 6 is provided with at least a plate-like top plate 7 facing in proximity to cover a wafer surface with a little clearance between it and a semiconductor wafer W, a speaker-cone shape vibration plate 8 and a ultrasonic vibrator 11. A space part between the top plate 7 and the vibration plate 8 is made a tank part 10 for storing a ultrasonic transmission medium 9, which transmits ultrasonic vibration and a supply nozzle 13 for spraying cleaning liquid, rinsing liquid and drying gas one by one to a surface of the semiconductor wafer W which rotates at a fast speed is made to face toward a rotation axis position of the wafer pad 3 from a center position of the top plate 7. The ultrasonic vibration device 6 is reciprocated ranging over a distance of at least the radius size of a semiconductor wafer parallel to the surface of a semiconductor wafer.
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