发明名称 |
Power electronics cooling apparatus |
摘要 |
A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.
|
申请公布号 |
US6016007(A) |
申请公布日期 |
2000.01.18 |
申请号 |
US19980206242 |
申请日期 |
1998.10.16 |
申请人 |
NORTHROP GRUMMAN CORP. |
发明人 |
SANGER, PHILIP ALBERT;LINDBERG, FRANK A.;GARCEN, WALTER |
分类号 |
H01L23/473;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/473 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|