| 摘要 |
PROBLEM TO BE SOLVED: To improve a seal reliability, reduce costs and simplify processes by sealing an electric coupling part of a printed wiring and/or a seal point of a contact part of ink with a substance composed of an epoxy resin. SOLUTION: A substrate having a heater and a driver formed in a general- purpose silicon process is die bonded to a base plate. A discharge hole is formed to a top plate, and the discharge hole and the heater are fixed by a spring, whereby a spring combination part is obtained. A silicon rubber sheet is sucked and tightly adhered to a mold of a transfer mold. The spring combination part is set in the mold. An epoxy resin 1007 is filled in the mold and set. An ink-jet head using the thermosetting epoxy resin is thus formed. Because of the use of the epoxy resin, an invasion of air bubbles is reduced and an adhesive strength to a structural member of the ink-jet head is prevented from being deteriorated. A seal process can be simplified by molding in one operation with the use of the epoxy resin.
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