发明名称 |
METHOD FOR COLLECTING METALLIC CONTAMINANTS FROM WAFER |
摘要 |
A sampling method for collecting metallic contaminants from a surface of a wafer having an oxide film thereon. A sampling vessel comprises a bottom having a concave inner surface and a convex outer surface, a cylindrical wall extending from the edge of the bottom, and a step section having a plane intercepting an arc plane of the cylindrical wall for adapting the orientation flat of the wafer. Sampling liquid containing 0.1 to 10% HF and hydrogen peroxide dissolves the oxide film and collects the metallic contaminants by swinging the sampling vessel on the convex outer surface of the bottom. |
申请公布号 |
KR100237722(B1) |
申请公布日期 |
2000.01.15 |
申请号 |
KR19970040114 |
申请日期 |
1997.08.22 |
申请人 |
NEC CORPORATION |
发明人 |
YAMASAKI, SHINYA;AOKI, HIDEMITSU |
分类号 |
G01N1/10;G01N1/28;G01N1/34;H01L21/66;(IPC1-7):G01N1/02 |
主分类号 |
G01N1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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