METHOD OF SECURING A SEMICONDUCTOR CHIP ON A BASE PLATE AND STRUCTURE THEREOF

摘要

A semiconductor chip such as a cold cathode is mounted on a base plate using a conventional solder or like metallic eutectic material or conductive paste, and then secured to the base plate using an inorganic adhesive or like material, which is capable of being hardened at a temperature lower than the mounting temperature, and the bonding strength of which is not deteriorated even at higher temperatures.