EPOXY INJECTING STRUCTURE OF SEMICONDUCTOR PACKAGE MOLDING DEVICE

摘要

PURPOSE: An epoxy injecting structure of a semiconductor package molding device is provided to reduce the prime cost by performing the molding processing. CONSTITUTION: The semiconductor package molding device having the epoxy injecting structure comprises: a bottom plate(12) guided into a guide post(11), moving up and down; a top plate(13) provided on the upper area of the bottom plate(12); and plural cavities(14) respectively combined on the lower area of the top plate(13) and the upper area of the bottom plate(12).