| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate manufacturing processes such as punching of through- holes, plating to the through-holes, filling of solder resist, and eliminating bubbles, to improve productivity and yield of a wiring board, and to reduce manufacturing cost when manufacturing the wiring board, where a wiring pattern which is provided both the surfaces of the board is connected electrically. SOLUTION: In a method for manufacturing a wiring board 10 where a wiring pattern 2 is provided on both the sides of a board 1, and the pattern 2 on both surfaces is connected electrically via a punched through-hole, a desired place where the wiring pattern 2 is formed is punched in the board 1, a coductor 4 which is separately formed is embedded in the through-hole, the wiring pattern 2 on both the surfaces is electrically connected for manufacturing the wiring board.</p> |
