| 摘要 |
PROBLEM TO BE SOLVED: To enable observing the surface temperature of a semiconductor component to be mounted. SOLUTION: A semiconductor component 11 is mounted on a heat block 4, and the semiconductor component 11 heated by warming the heat block with a heater 3 fixed to the heat block. By receiving the output of a thermocouple 6, temperature of the heater is controlled with a temperature adjuster 5. Temperature of the heat block is kept constant, and bonding treatment is performed with a wire bonding head 2. The surface temperature of the semiconductor component is directly measured with noncontact type thermometer 12 including an infrared ray detecting element. When a temperature is equal to or lower than a specified value, an abnormal signal is generated from an output device 13. |
