| 摘要 |
PROBLEM TO BE SOLVED: To block optical observation from the rear side by forming plural rugged parts on the rear side of a semiconductor substrate, forming these parts in the area corresponding to an integrated circuit and forming these parts by grinding with grains harder than the semiconductor substrate. SOLUTION: Plural integrated circuits 2 are formed on the main front side of a substrate 1 being a silicon wafer, a protecting tape 3 for protecting the surfaces of these integrated circuits 2 is stuck on this surface, and an adhesive plane is formed on the face opposite to an IC chip. Next, while using a grinding device to which the grindstone having the grading of '#600' is set, the substrate 1 is ground until its thickness becomes 100 μm. Further, the entire rear side of the substrate 1 is ground while uniformly touching the grindstone rotating at high speed, the substrate 1 is thinned and rugged steps are formed over all the rear side. Continuously, the protecting tape 3 adhered on the surface of the substrate 1 is peeled and divided in each integrated circuit and the IC chip for IC card is completed. |
