| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate splitting device capable of preventing generation of an adverse effect on a printed circuit board molded into an original substrate and cutting an excessive substrate around a printed circuit board easily. SOLUTION: An upper fixing part 50 is driven so as to approach a lower fixing part 40, and an original substrate 1 is sandwiched and fixed between a substrate pressure pin 43 standingly provided to the lower fixing part 40 and a substrate pressure pin 53 hung from the upper fixing part 50. Substrate splitting mechanisms 60a to 60e are disposed at the external position of the excessive substrate of the original substrate 1, and the excessive substrate is grasped by its substrate grasping part. The substrate grasping part is oscillated vertically to split the excessive substrate from the printed circuit board.
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