| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrodeposition coating device which is capable of efficiently suppressing the rise of the concentration of cupper ions in an electrodeposition cell in accordance with the progress of the electrodeposition coating treatment. SOLUTION: In the electrodeposition coating device P, the electrodeposition coating is applied on a material 1 to be coated in the electrodeposition cell 4, and an electrodepositing liq. 5 or an electrodeposition coating material stuck to the material 1 to be coated is washed/recovered in a recovering vessel 9. At this point, the major part of cupper ion chelate produced in the electrodeposition cell 4 is carried into the recovering vessel 9 while accompanying the material 1 to be coated. Then, an ultrafilter 19 is provided in a liq. feeding path which refluxes a recovered liq. 10 in the recovering vessel 9 to the electrodeposition cell 4 and a filtrate only from this ultrafilter 19 is fed to the electrodeposition cell 4. Since the cupper ion chelate is hardly incorporated in this filtrate, the cupper ion chelate carried into the recovering vessel 9 is not returned to the electrodeposition cell 4, thereby suppressing the rise of the concn. of the cupper ions in the electrodeposition cell 4.
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