| 摘要 |
PROBLEM TO BE SOLVED: To enable adhesion of a required volume of solder to a printed board by unstalling a mounting stand at an outside bottom part of a retreating side nozzle plate of a jet solder tank, and detachably installing a retreating side former wherein the upper face slant angle is decided in advance on the stand. SOLUTION: In a retreating side nozzle plate 4, an upper plate 8 is fixed to a lower plate 7, and is adjustable in an upper/lower direction. A molten metal jetted from a nozzle floats on an upper face of a retreating side former 11, and the upper face of the retreating side former 11 is inclined downwards in a flowing direction so as to float the molten metal at a fast speed. Therefore, the molten solder flowed along a bent part beyond a retreating side nozzle plate 4 is flowed at a fast flow speed. Thus, the volume of the solder adhered to the printed board becomes a required one. Exchanging of the retreating side former can be carried out by a simple operation wherein it is put on the stand 9 so as to obtain proper slant angle, excellent reliability, excellent workability, and excellent safety.
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