| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent solder from being buried in a through-hole for post-soldering a part in a printed wiring board, having a through-hole for pre- soldering a part and a through-hole for post-soldering a part. SOLUTION: In a printed wiring board having an insulating substrate 21, a through-hole 23 for pre-soldering a part which is made in the substrate 21 and into which a terminal 27a of a packaged part 27 is inserted, a through-hole 25 for post-soldering a part which is made in the substrate 21 and into which a terminal 29a of a packaged part 29 is inserted, a land 31 formed on one side 21a of the substrate 21 in annular shape around the through-hole 23, and a land 33 formed on one side 21a of the substrate 21 in annular shape around the through-hole 25, a region 39 of non-attached solder 43 is formed on the land 33.
|
