| 摘要 |
PROBLEM TO BE SOLVED: To obtain a circuit board material excellent in flatness, smoothness, electric insulating property, workability and chemical durability, having an appropriate coefft. of thermal expansion and useful for a circuit board for mounting a semiconductor, etc. SOLUTION: The circuit board material comprises an alkali-free glass contg., by weight, 30-50% SiO2, 1-10% B2O3, 1-10% Al2O3, 20-50% BaO, 0-20% SrO, 0-5% MgO and 0-15% CaO and preferably contg. at least one selected from ZnO, TiO2, ZrO2, Nb2O5, Sb2O3, SnO2, La2O3, Bi2O3, Y2O3, and F as other component.
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