发明名称 Vorrichtung zum Herstellen von Drahtverbindungen an Halbleiterchips
摘要 The apparatus includes a contacting element (10) carrying a capillary tube (12) with a connector wire (3'). A carrier unit (30) holds the contacting element and is movable parallel to the chip surface, and a flexible link structure (G) joins the contacting element with the carrier unit. The link structure includes a pair of flexurally elastic laminas (22) arranged symmetrically about a plane (S), and results in a pivot axis (A2) which is oriented parallel to the chip surface and is located outside the link structure. The two converging laminas, together with stiff elements (23,24) joining them, form a single trapezium-shaped frame (20). The stiff elements are respectively joined to the carrier unit and the contacting element.
申请公布号 DE59700776(D1) 申请公布日期 2000.01.05
申请号 DE1997500776 申请日期 1997.04.08
申请人 ESEC S.A., CHAM 发明人 PASQUIER, LAURENT
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K20/00 主分类号 H01L21/60
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