发明名称 CONNECTION STRUCTURE FOR WIRING AND FORMATION OF CONNECTION PART OF THE WIRING
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of a wiring, which has good continuity conditions over long time, even if metallic atoms constituting a wiring move through electromigration and is excellent in connection reliability, and its manufacturing method. SOLUTION: A projecting connection part of a second wiring 28 enters inside the through-hole of a connection part of a first wiring 18 and is connected electrically to a main wiring part 19 of a first wiring through a TiN film 16a for a connection part and a Ti film 17 a for a connection part formed inside the through-hole in connection to a region, including part of opposite long sides of an opening of a connection part of the first wiring 18 and is connected directly also to an end part of the Ti film 17a and the TiN film 16a exposed to an opening part of the through-hole and a main wiring part 19 in proximity thereto.
申请公布号 JPH11354637(A) 申请公布日期 1999.12.24
申请号 JP19980163304 申请日期 1998.06.11
申请人 OKI ELECTRIC IND CO LTD 发明人 HARADA YUSUKE
分类号 H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L23/532 主分类号 H01L21/3205
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