| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a package, that can prevent a bonding impact from causing concentration of stress and can disperse the stress so as to mount elements and wires without damage, by setting at least one of layers between pad electrodes, elements, and wires with an average evenness of 0.5 μm or less, or controlling a capacity ratio of an interconnection layer and an insulator. SOLUTION: Each surface of electric insulating layers 4 (a, b, c) is set with an average evenness of 0.5 μm or less between terminal electrodes 2 and elements 5. The average evenness is achieved by, for example, a chemical and mechanical polishing. This arrangement makes it possible to reduce concentration of stress especially on a part having a large unevenness due to a bonding impact so as to prevent damage on the elements disposed below. Further, a capacity ratio of a wire and an insulator is controlled so as to prevent concentration of stress upon bonding and mounting. Consequently, it is possible to mount the elements and the wires without damage. |
