Via-filling conductive paste composition

摘要

A conductive paste composition, which is superior in electrical connection reliability and has properties required for via-filling, contains not more than 5 parts by weight solvent per 100 parts by weight of the total of A: 86 to 95 parts by weight of silver-coated copper particles; B: 2 to 8 parts by weight of a liquid epoxy resin having two or more epoxy groups; C: 2 to 8 parts by weight of a resol-type phenol resin; and D: 0.5 to 5 parts by weight of a curing agent for an epoxy resin, the composition having a viscosity not more than 1000 Pa.s.