SUBSTRATE HANDLING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate handling device which does not allow water to attain the oversurface of a top ring or the water to intrude into a coupling which couples the top ring with a rotary shaft swingably. SOLUTION: This substrate handling device is equipped with a handling mechanism which makes of a substrate W as a work to be polished to/from a top ring 12 for holding the substrate W and nozzles 44a and 44b to spray water toward the top ring 12 situated over the handling mechanism, wherein a water drop dispersion plate 53 in umbrella form is installed over the handling mechanism so that the top ring 12 is covered when it is positioned over the handling mechanism.