SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A recessed groove (3) is formed on one surface of a package substrate (2) made of a glass/epoxy resin and coated with a solder resist (8) on both sides, and a semiconductor chip (4) which is encapsulated with a potting resin (6) is provided in the groove (3). A plurality of wirings (1) each of which is electrically connected to the semiconductor chip (4) through a wire (7) on one side are formed around the groove (3), and solder bumps (9) constituting the outer connecting terminals of a CSP are connected to the surfaces of land sections (1A) formed in the middle sections of the respective wirings (1).