发明名称 ANORDNUNG ZUM DICHTEN UMSCHLIESSEN EINES SUBSTRATES
摘要 An arrangement for tightly enclosing a substrate with a heat-shrinking plastic sleeve (1), which has thickened sections (2, 3) along its longitudinal edges, has at least two rails (4, 5) pushed on the sleeve (1) after it has been placed around the substrate. The rails hold the longitudinal edges of the sleeve (1) together before, during and after the heat-shrinking. The two rails (4, 5) form a junction area and S-shaped profiles (6, 7) are placed in the junction area on both sides of the thickened edge sections (2, 3) and are enclosed by both of the rails (4, 5).
申请公布号 AT187584(T) 申请公布日期 1999.12.15
申请号 AT19960114521T 申请日期 1996.09.11
申请人 ALCATEL 发明人 STIEB, WERNER, DIPL.-ING.
分类号 B29C61/10;F16B5/00;H02G15/18;(IPC1-7):H02G15/18 主分类号 B29C61/10
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