发明名称 COPPER PLATED SUBSTRATE AND BONDING AGENT SHEET FOR TAB
摘要 PROBLEM TO BE SOLVED: To provide excellent heat resistance and flexibility, by specifying the softening point of unhardened heat resisting resin bonding agent, specifying the bonding strength of a laminated body, and specifying the radius of curvature indicating the curling property measured by etching a copper foil. SOLUTION: This material comprises the laminated body wherein a heat resisting film and a copper foils are attached with heat resisting resin bonding agent. The bonding strength of the laminated body at 180 deg.C is 0.5 kg/cm or more. The radius of curvature indicating the curling property measured by etching the copper foil is 100 mm or more. The softening point of the unhardened heat resisting resin bonding agent is 150 deg.C or less. In the heat resisting resin bonding agent, aromatic tetracarboxylic acids whose main component is biphenyl tetracarboxylic acids, the fusible polyimide siloxane obtained from diamino-polysiloxane and aromatic diamine, the epoxy compound having an epoxy substrate and the composition indulging epoxy hardening agent as a resin component are adequately used.
申请公布号 JPH11345843(A) 申请公布日期 1999.12.14
申请号 JP19990083843 申请日期 1999.03.26
申请人 UBE IND LTD 发明人 INOUE HIROSHI;TAKABAYASHI SEIICHIRO;MURAMATSU TADAO;FUNAKOSHI TSUTOMU;HIRANO TETSUHARU
分类号 H05K1/03;C09J7/02;C09J163/00;C09J179/08;C09J183/10;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K1/03
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