| 发明名称 |
Surface-mountable radiation-emitting component and method of producing such a component |
| 摘要 |
A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.
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| 申请公布号 |
US2004188697(A1) |
申请公布日期 |
2004.09.30 |
| 申请号 |
US20030747703 |
申请日期 |
2003.12.29 |
| 申请人 |
BRUNNER HERBERT;HOHN KLAUS;JAGER HARALD;SCHMID JOSEF |
发明人 |
BRUNNER HERBERT;HOHN KLAUS;JAGER HARALD;SCHMID JOSEF |
| 分类号 |
H01L33/48;H01L33/54;H01L33/62;H05K3/34;(IPC1-7):H01L21/00;H01L33/00 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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