| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device so as to eliminate voids from a sealing resin, by forming an inclined surface on one edge of the rear surface of a semiconductor element mounted in a face-down state. SOLUTION: After a circuit board 5 mounted with a semiconductor element 1 is placed on a hot plate 12 and heated, a sealing resin 8 is dropped onto an inclined surface 1a provided on one edge of the element 1 from the front end of the nozzle 13 of the dispenser of a sealing machine. The resin 8 dropped onto the inclined surface 1a of the element 1 reaches the opened end of the clearance section 9 between the element 1 and circuit board 5 through the inclined surface 1a and enters the clearance section 9 due to a capillary phenomenon. Since the resin 8 is injected through the inclined surface 1a provided at one edge of the rear surface of the element 1, it is not required to enlarge the sealing resin injecting side 5a of the circuit board 5 and, since the size of the circuit board 5 can be reduced, the size of a semiconductor device can be reduced. Since no void exists in the sealing resin 8, in addition, a highly reliable semiconductor device can be obtained. |
