| 摘要 |
PROBLEM TO BE SOLVED: To reduce adhesion of sintered bodies by treating in advance the same composition material as a cermic electronic part to be baked, at higher temperature than a normal baking temperature, crushing and adjusting it, mixing it with a binder made of the same composition as one for molding the ceramic electronic part, and using it as a material for preventing fusion. SOLUTION: A slurry of a dielectric powder made mainly of barium titanate and an organic binder is used to form a green sheet (sheet). Next, an internal electrode made mainly of Ni is deposited on the sheet surface. Then sheets each printed with the internal electrode are piled up by 70 layers in such a manner that the internal electrode is laminated with the sheet interposed, and an invalid layer in which only the sheet is piled up by ten layers is overlapped on both surfaces thereof, thereby forming a green laminated body. Then the green laminated body is cut into chips. Further, after a powder of the same composition as the sheet is baked temporarily at 1200-1400 deg.C, and its average grain size is adjusted to 20μm, and a binder for green chip is added thereto so as to form a material for preventing fusion, and it is adhered to the chip and is baked thereafter.
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