| 摘要 |
PROBLEM TO BE SOLVED: To easily attain cleaning, and to reduce the frequency of cleaning by setting and executing a cleaning timing in an optimal mode according to the kind and using state of processor. SOLUTION: When a developing processing to the prescribed number of wafers W or the prescribed number of lots of wafers W with is ended, or when a time interval since developer is applied to the preceding wafer W by a developer supply nozzle 41 until the developer is applied to the following wafer W is beyond a prescribed time, or when either of them is detected, the developer supply nozzle 41 is moved by a moving mechanism 43, and the top end part is mounted on a cleaning mechanism so that the developer supply nozzle 41 can be cleaned by the cleaning mechanism by a controller. |
