| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure, which is excellent in cooling capacity and is simple in structure, of an electronic element. SOLUTION: A CPU 4 is mounted on the upper surface of a substrate 1 via a bonding agent 3. A plurality of through holes are formed in the part, which is located under the side of the lower part of the CPU 4, of the substrate 1 and pins 9, which are metallic and are longer than the thickness of the substrate 1, are inserted in the through holes in such a way as to protrude from the lower surface of the substrate 1. Moreover, the protruding parts of the pins 9 are inserted in insertion holes 12 formed in a heat pipe 10 in such a way that heat can be transferred from the pins 9 to the heat pipe 10. |
