| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device of high electrical reliability, by preventing peeling between heat-dissipating plate and semiconductor element, a semiconductor element and lead pin, and, a lead pin and protective resin. SOLUTION: A semiconductor element 2 is fitted to a pan-type heat- dissipating plate 1, and a lead pin 3 electrically connected to the semiconductor element 2. The lead pin 3 comprises a fitting part 3A, an intermediate part 3B, and a pin part 3C. The fitting part 3A is directly fitted to the semiconductor element 2. The pin part 3C is formed into a diameter smaller than the fitting part 3A. The intermediate part 3B, being formed into an intermediate diameter between the fitting part 3A and the pin part 3C, connects the fitting part 3A and the pin part 3C. The inside of the pan of the heat-dissipating plate 1 is filled with a hard protective resin 4, covering the semiconductor element 2 and the fitting part 3A of the lead pin 3, within the range of the intermediate part 3B.</p> |
