| 摘要 |
PROBLEM TO BE SOLVED: To prevent the noises from the outside, by covering the inner wall of a package main body housing an IC pellet, and forming an outer withdrawing lead in a coaxial type. SOLUTION: At the IC-pellet mounting part of a case substrate 1, an IC pellet 3 is mounted by conductive mounting member 2. The electrode of the IC pellet 3 and a central conductor 4 of the outer withdrawing lead of the upper surface of the surrounding wall of the case 1 are connected by boding wires 7. The outer surface of the central conductor 4 of the outer withdrawing lead is surrounded by an insulator 5. Furthermore, the outer surface of the insulator is covered with an outer conducting film 6 and formed in the coaxial type by plating and the like. Then, the upper part of the surrounding wall of the case 1 is covered by a cap 8 and sealed in the airtight pattern by a bonding agent 9. Furthermore, a conducting film 10 is covered by plating at the inner wall of the cap 8. The conducting film 10, the IC mounting member 2 and the outer conducting film 6 are grounded to GND of the IC altogether. |
