发明名称 |
Processing apparatus for substrates |
摘要 |
For shortening the time for introducing an inactive gas, such as nitrogen gas, into a load lock chamber of a processing apparatus for substrates, a buffer tank 19 having a capacity larger than that of the load lock chamber 3 is provided in the path of a pipe for introducing the nitrogen gas into the load lock chamber 3 of the processing apparatus. During processing within the processing chamber 2, such as an ashing process and so on, the nitrogen gas is introduced into the load lock chamber 3 from the buffer tank 19 by operating a valve mechanism 21 to increase the pressure within the load lock chamber 3 up to atmospheric pressure.
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申请公布号 |
US5980684(A) |
申请公布日期 |
1999.11.09 |
申请号 |
US19970965437 |
申请日期 |
1997.11.06 |
申请人 |
TOKYO OHKA CO., LTD. |
发明人 |
HORI, HISASHI;KAWAMURA, YOSHITSUGU;OBUCHI, KAZUTO |
分类号 |
H01L21/302;C23C14/56;H01L21/00;H01L21/027;H01L21/3065;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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