MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable a semiconductor device to be easily manufactured at low cost by a method, wherein two packages are bonded together into a single piece for the formation of the semiconductor device. SOLUTION: One ends of wires 2 are bonded to a semiconductor element 1, the semiconductor element 1 is encapsulated with resin into a first package 3, a lead frame or a circuit board 5 is encapsulated with resin into a second package 4, and the first package 3 and the second package 4 are bonded together into a single piece via an adhesive agent, bonding the other ends of the wires 2 to a circuit on the circuit board 5.