Automated defect spatial signature analysis for semiconductor manufacturing process

摘要

An apparatus and method for performing automated defect spatial signature analysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.