| 摘要 |
PROBLEM TO BE SOLVED: To eliminate an adhesive layer on a base sheet, by using a base sheet composed of a polystyrene(SPS) resin compsn. having a syndiotactic structure and fiber reinforcement, and using an SPS resin compsn. as a resin to form a mold. SOLUTION: A glass fiber cloth treated with a mercaptosylane coupling agent is sandwiched between two sheets of 0.06 mm thick previously obtd. by extruding an SPS resin compsn., using a T-die extruder, and double-sided roughened electrolytic Cu foils of 18μm are laid on the upper and lower surfaces thereof and pressed for 5 min to infiltrate the SPS resin compsn. in the glass fiber cloth and closely integrate the Cu foils. A base sheet is constituted by infiltrating the SPS resin compsn. in the fiber reinforcement, hence has a sufficient heat resistance and strength as a printed wiring board, the printing wiring board can be closely integrated with the resin molding without forming an adhesive layer, and thus, it is possible to eliminate the need of forming the adhesive layer.
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