| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a TAB tape, which is superior in improved characteristics of a device and miniaturization, and connecting and sealing properties for the TAB tape and a semiconductor chip, the semiconductor device using this TAB tape, and a manufacturing method thereof. SOLUTION: An opening part 43 is formed on a resin base body 41 so that the opening part is larger than a semiconductor-chip mounting region 2. In the opening part 43, a grounding plane 42 is connected to a plurality of grounding leads 5 and supported. As a result, the potential of each connecting lead 45 is stabilized by the grounding plane 42. Furthermore, the grounding plane 42 has a ring-shaped pattern, and since the resin base body 41 is not present at the back-surface side in the resin encapsulating process after the semiconductor chip is mounted on the TAB tape, the sneaking around the resin into the surrounding part of the ground plane 42 is satisfactory and the filling property is superior.</p> |
