RIGID INTERCONNECT DEVICE AND METHOD OF MAKING

摘要

A rigid interconnect device (10) includes a first layer (20) having a first side (14) and a second side (16). The first layer (20) is made of LARC-SI. The second side (16) has electrical circuitry (18). Second layer (24) has a first side (14) and a second side (16). The second layer is made of LARC-SI. The first side (14) of the second layer is in contact with the second side (16) of the first layer. A method for producing this device is also disclosed which includes the step of depositing LARC-SI onto a rigid substrate (12). Then, the LARC-SI is cured to form first layer (20). The first side (14) of this layer is in contact with the rigid substrate (12).