| 摘要 |
PROBLEM TO BE SOLVED: To improve conveying workability of wafers and to uniformly polish the surface of the wafers. SOLUTION: A stage 2 is provided with pressing holes 2a on the circumference, and suction holes 2b on the circumference, in positions closer to the outer peripheral edge side than to the pressing holes 2a. A cavity part 2c connected to the pressing holes 2a and the suction holes 2b is provided inside the stage 2. Furthermore, first filters 8a allowing gas to flow from the cavity part 2c side only to the wafer holding face side are arranged between the pressing holes 2a and the cavity part 2c, and second filters 8b allowing gas to flow from the wafer holding face side only to the cavity part 2c side are arranged between the suction holes 2b and the cavity part 2c. |
