发明名称 MEANS FOR CONTROLLING TARGET EROSION AND SPUTTERING IN A MAGNETRON
摘要 <p>A sputtering magnetron with a rotating cylindrical target and a stationary magnet assembly (22, 24*) is described, said magnet assembly (22, 24*) being adapted to produce an elongate plasma race-track on the surface of said target, said elongate race-track having substantially parallel tracks over a substantial portion of its length and being closed at each end by end portions (22'), wherein the spacing between the tracks of said race-track is increased locally to materially effect sputtering onto a substrate. The increase in spacing may be at the end portions or along the parallel track portion. The increase in spacing may provide more even erosion of the target beneath the end portions of the race-track, provide more even coatings on the substrate, for instance.</p>
申请公布号 WO1999054911(A1) 申请公布日期 1999.10.28
申请号 EP1999002646 申请日期 1999.04.14
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