发明名称 POSITIVE RESIST COMPOSITION
摘要 A positive resist composition comprising a hydroxypolyamide represented by general formula (I) and a photoactive ingredient: wherein R1 and R3 may be the same or different and each is a tetravalent aromatic group; R2 is a divalent aromatic group; n is an integer of 2 to 150; and Z's each is a monovalent organic group, provided that at least 40 % thereof each is a group represented by the following structural formula (II) -X-R4-(COOH)m (wherein X is carbonyl or sulfonyl; m is an integer of 0 to 3, provided that when X is carbonyl, then m is not 0; and R4 is an aliphatic group containing neither alkenyl nor alkynyl, an alicyclic group, or an aromatic group, provided that when X is carbonyl and R4 is an alicyclic or aromatic group, then at least one of the carboxyl groups is located in an ortho position).
申请公布号 WO9954787(A1) 申请公布日期 1999.10.28
申请号 WO1999JP02002 申请日期 1999.04.15
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA;TAKAHASHI, HIDEAKI;KIMURA, MASASHI;SASAKI, TAKAHIRO 发明人 TAKAHASHI, HIDEAKI;KIMURA, MASASHI;SASAKI, TAKAHIRO
分类号 C08G69/02;C08G69/26;C08G69/32;C08G69/48;G03F7/023;(IPC1-7):G03F7/037;G03F7/022;C08L77/06;C09D177/06;H01L21/027 主分类号 C08G69/02
代理机构 代理人
主权项
地址