发明名称 |
POSITIVE RESIST COMPOSITION |
摘要 |
A positive resist composition comprising a hydroxypolyamide represented by general formula (I) and a photoactive ingredient: wherein R1 and R3 may be the same or different and each is a tetravalent aromatic group; R2 is a divalent aromatic group; n is an integer of 2 to 150; and Z's each is a monovalent organic group, provided that at least 40 % thereof each is a group represented by the following structural formula (II) -X-R4-(COOH)m (wherein X is carbonyl or sulfonyl; m is an integer of 0 to 3, provided that when X is carbonyl, then m is not 0; and R4 is an aliphatic group containing neither alkenyl nor alkynyl, an alicyclic group, or an aromatic group, provided that when X is carbonyl and R4 is an alicyclic or aromatic group, then at least one of the carboxyl groups is located in an ortho position).
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申请公布号 |
WO9954787(A1) |
申请公布日期 |
1999.10.28 |
申请号 |
WO1999JP02002 |
申请日期 |
1999.04.15 |
申请人 |
ASAHI KASEI KOGYO KABUSHIKI KAISHA;TAKAHASHI, HIDEAKI;KIMURA, MASASHI;SASAKI, TAKAHIRO |
发明人 |
TAKAHASHI, HIDEAKI;KIMURA, MASASHI;SASAKI, TAKAHIRO |
分类号 |
C08G69/02;C08G69/26;C08G69/32;C08G69/48;G03F7/023;(IPC1-7):G03F7/037;G03F7/022;C08L77/06;C09D177/06;H01L21/027 |
主分类号 |
C08G69/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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