发明名称 Latent-reactive hot melt adhesive which is stable in storage, and a method for bonding a modular component
摘要 A latent hot-melt adhesive containing (A) surface-deactivated polyisocyanate, (B) isocyanate-reactive polymer and (C) additives, in which hydrophobicity is adjusted by the combination of (B) and (C) so that the adhesive gives a non-porous cured bead after storage for at least 120 hours under normal conditions. A hot melt adhesive with good storage stability and latent reactivity, containing (A) solid, surface-deactivated polyisocyanate(s), (B) polymer(s) which are able to react with isocyanate (NCO) groups and (C) additive(s), in which the hydrophobicity of the adhesive is adjusted by the qualititative and quantitative combination of (B) and (C) in such a way that an essentially uncrosslinked layer of adhesive applied to a substrate gives an essentially non-porous cured joint after storage for at least 120 hours under normal conditions. Independent claims are also included for (a) a hot-melt adhesive as above in which component (B) comprises linear and/or partly branched, unsaturated, partly saturated and/or saturated hydrocarbon polymers; (b) a process for bonding a modular component with another substrate with this adhesive; (c) a modular component bonded to substrate(s) with this adhesive, in which the hardened adhesive/substrate and adhesive/component interfacial layers are essentially non-porous.
申请公布号 AU3244299(A) 申请公布日期 1999.10.25
申请号 AU19990032442 申请日期 1999.03.17
申请人 EFTEC AG 发明人 DETLEF SYMIETZ;BERNARDO WALTERSPIEL;URS REMPFLER
分类号 C08G18/62;C08G18/70;C08G18/80;C09J5/06;C09J175/04 主分类号 C08G18/62
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