| 摘要 |
PROBLEM TO BE SOLVED: To reduce cracks in a solder reflow by a method wherein an insulation protection resist covering an insulation space on a semiconductor element mounted face is disposed only in an outside part from a terminal electrically connected to an element electrode of a wiring pattern. SOLUTION: An insulation protection resist 4 is disposed only in an outside part from a gold plated terminal 8 on a semiconductor element mounted face. And, a region which reaches from an outside part of a semiconductor element 1 or a ground wiring pattern 7 to a gold plated terminal 8 is exposed with an insulation base material 2, and is firmly adhered to an organic insulation seal material 5. Thus, moisture accumulated in an adhesive material 3 layer is evaporated and expanded, and if steam is advanced outwardly from an interface between the insulation base material 2 and the organic insulation seal material 5, it is possible to prevent releasing until a gold plated terminal region 8 of a wire bonding part by a firmly adhesive force between the insulation base material 2 and the organic insulation seal material 5. |
