发明名称 LEAD FRAME AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To improve bonding characteristic in an inner lead with a dimpled part and to maintain strength of an island. SOLUTION: A lead frame includes an outer frame 1, a both-end supported inner lead 5 with both upper and lower ends 5a and 5b joined as a body with the outer frame 1, and a one-end supported inner lead 6 with one end 6c joined with the outer frame 1 and the other free end 6d with a manufactured dimple part. The end 6d of the one-end supported lead 6 is fixed to the both-end supported lead 5 with a joining insulation member 9. The one-end supported lead 6 has a dimple manufactured part (recessed part) 6a at a middle position between an end 6c joined to the outer frame 1 and the end 6d which is bonded with the insulating member 9.</p>
申请公布号 JPH10340988(A) 申请公布日期 1998.12.22
申请号 JP19970151239 申请日期 1997.06.09
申请人 NEC CORP 发明人 KAMIMURA TETSUHIRO
分类号 H01L23/48;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/48
代理机构 代理人
主权项
地址