RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, AND LAMINATE FOR PRINTED CIRCUIT BOARD, LAMINATE FOR MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE OF BALL GRID ARRAY TYPE PREPARED BY USING THE SAME,申请号JP19980087281-传众专利搜索

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发明名称	RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, AND LAMINATE FOR PRINTED CIRCUIT BOARD, LAMINATE FOR MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE OF BALL GRID ARRAY TYPE PREPARED BY USING THE SAME
摘要
申请公布号	JPH11279373(A)	申请公布日期	1999.10.12
申请号	JP19980087281	申请日期	1998.03.31
申请人	MITSUBISHI ELECTRIC CORP	发明人	HATANAKA YASUMICHI;OKA SEIJI;FUJIOKA HIROFUMI;YAMAGUCHI AKIHIKO;FUNAHASHI KAZUO
分类号	H05K1/03;C08G59/62;C08L63/00;H01L23/14;(IPC1-7):C08L63/00	主分类号	H05K1/03
代理机构		代理人
主权项
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