Substrate edge connnector

摘要

A combined optical and electrical interconnection means for interconnection of in particular chip modules has an elastic layer of for instance silicone placed over the sharp edge or corner connecting surfaces where the interconnection is made. On the front surface the layer covers an end of an optical waveguide having a core and on the top surface the layer carries an electrically conducting area connected to an electric transmission line. The front surfaces are pressed against each other connecting the ends of the optical waveguides. On the top surface the conducting area is in contact with interconnected electrically conducting areas on a surface of a connector strip. This interconnection structure is able to connect densely located electrical lines and optical waveguides not requiring any fan-out configuration. It is particularly suited for interconnecting compact multi-chip modules and similar devices.