| 摘要 |
PROBLEM TO BE SOLVED: To realize the stable operation of a semiconductor process by precisely measuring the film thickness of a wafer internal device in a short time and quickly performing the feedback to the process. SOLUTION: This system is formed of an FIB device 1 capable of sampling an analyzing part from a semiconductor wafer without breaking the wafer, a STEM 2, a small-sized sample table commonly mountable on a wafer holder for FIB and a sample holder for STEM, a computer 3 having a data base software, and a network 5 for mutually connecting the FIB, the STEM, and the computer, so that the film thickness in a wafer can be precisely, quickly and surely measured. |
