| 摘要 |
PROBLEM TO BE SOLVED: To obtain a lead frame by which a semiconductor chip is connected surely to a lead and to an island and by which a small semiconductor device without an internal connection defect can be manufactured easily and to obtain a manufacturing method for a semiconductor device. SOLUTION: A lead frame is provided with a plurality of leads 10 and with an island 14 which is formed at the tip of one of them and on which a semiconductor chip is mounted. In the lead frame, protrusions 14a, 14b are formed on the side of the lead 14 which is parallel to the leads 10. When the semiconductor chip is mounted on the island 14 and when the semiconductor chip is wire- bonded to the leads 10 and to the island 14, the protrusions 14a, 14b are pressed so as to prevent the island 14 from being levitated from a stage. The protrusions 14a, 14b are formed preferably in positions at a distance from the leads 10, and they can be formed in any one or both of two sides which are parallel to the leads 10. |
