METHOD OF MANUFACTURING PLATE FOR FORMING SOLDER BALL METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND THE SEMICONDUCTOR DEVICE,申请号JP19980061219-传众专利搜索

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发明名称	METHOD OF MANUFACTURING PLATE FOR FORMING SOLDER BALL METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND THE SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH11260766(A)	申请公布日期	1999.09.24
申请号	JP19980061219	申请日期	1998.03.12
申请人	FUJITSU LTD	发明人	YAMADA YUTAKA
分类号	H01L23/12;H01L21/301;H01L21/60;H05K3/34;(IPC1-7):H01L21/301	主分类号	H01L23/12
代理机构		代理人
主权项
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