发明名称 SPUTTERING APPARATUS WITH A COIL HAVING OVERLAPPING ENDS
摘要 <p>A coil for inductively coupling RF energy to a plasma in a substrate processing chamber has adjacent spaced and overlapping ends to improve uniformity of processing of the substrate.</p>
申请公布号 WO1999048131(A1) 申请公布日期 1999.09.23
申请号 US1999005265 申请日期 1999.03.11
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