| 摘要 |
PROBLEM TO BE SOLVED: To perform polishing for a ball semiconductor device by relatively rotating a housing board, a first encircling board and a second encircling board to polish the ball semiconductor while supplying free abrasive grains to the ball semiconductor housed in a housing section. SOLUTION: When a housing board, and first and second encircling boards 18 and 19 are rotated relative to one another, a ball semiconductor is revolved. The ball semiconductor is housed with certain room in a housing section, and the first and second encircling boards 18 and 19 are rotated in directions opposite to the housing board, and thus the ball semiconductor rotates in the housing section. Thus, the ball semiconductor housed in the housing section is revolved while rotating. The ball semiconductor is brought by its revolution into contact with the inner peripheral surface of an annular board 17, the lower surface of the first encircling board 18 and the upper surface of the second encircling board 19. Accordingly, the surface of the ball semiconductor is polished by the polishing cloth of these surfaces. |
