发明名称 |
Process for etching semiconductor wafers |
摘要 |
A semiconductor wafer etching process uses an etchant mixture which is formed by mixing nitric and hydrofluoric acids and optionally a surface active agent and which is subsequently topped up with hydrofluoric acid and optionally nitric acid. The novelty is that the etchant mixture is formed by mixing either ≥ 70 wt.% nitric acid and greater than 50 wt.% hydrofluoric acid or greater than 70 wt.% nitric acid and ≥ 50 wt.% hydrofluoric acid, preferably 73-98 wt.% nitric acid and greater than 60 to 95 wt.% hydrofluoric acid. The or each topping-up acid may have the same concentration or a 5-10% higher concentration than the corresponding acid used to form the mixture. |
申请公布号 |
SG67503(A1) |
申请公布日期 |
1999.09.21 |
申请号 |
SG19980001059 |
申请日期 |
1998.05.15 |
申请人 |
WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG. |
发明人 |
BAUER THERESIA;WEIZBAUER SUSANNE;BERGLER ALFRED;WOCHNER HANNS |
分类号 |
H01L21/306;H01L21/308 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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