Mounting semiconductor components and modules onto coupling frame

摘要

The mounting uses a first coupling frame with holding (5) and fin (7) portions, and a second coupling frame of identical configuration. There is at least one semiconductor chip and an encapsulation substance to be located on the fin portion. The first frame is secured to the second one such that the chip is fitted between the fin portion and coupling line. Electric connections are formed between the coupling line and chip as well as between the chip and the fin portion. The whole assembly is then encapsulated. Independent claims are also included for a semiconductor housing and coupling frame.